以第一作者/通讯（含共同）发表论文二十余篇，授权中国发明专利10余项，授权美国发明专利1项。

代表性科研论文：

[1] Hutao Shi^#, Chunming Cheng^#, Chao Sun, Zhenyang Lei, Gai Wu, Lijie Li, Kang Liang^*, Wei Shen^*, Sheng Liu. Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2024.

[2] Taiqiao Liu, Fanglin Lyu, Tian Shao, Diwei Zou, Wei Shen*, Yuzheng Guo, Yuan Zhong, Chaoyang Chen, Liangchen Yi, Zhaofu Zhang*, and Andy H. Shen*. Insights into the Nitrogen-vacancy Center Formation in Type-Ib Diamond by Irradiation and Annealing Approach, Materials Future. 2024.

[3] Zhanpeng Sun#, Xiang Sun#, Zijun Qi, Qijun Wang, Rui Li, Lijie Li, Gai Wu*, Wei Shen*, Sheng Liu. Investigating thermal transport across the AlN/diamond Interface via the machine learning potential[J]. Diamond and Related Materials, 2024: 111303.

[4] Zijun Qi^#, Xiang Sun^#, Zhanpeng Sun, Qijun Wang, Dongliang Zhang, Kang Liang, Rui Li, Diwei Zou, Lijie Li, Gai Wu^*, Wei Shen^*, Sheng Liu. Interfacial optimization for AlN/diamond heterostructures via machine learning potential molecular dynamics investigation of the mechanical properties. ACS Applied Materials & Interfaces, 2024.

[5] Wei Shen^#, Zhenyang Lei^#, Kang Liang*, Gai Wu, Tian Zeng*, Sheng Liu. Effect of warpage on solder joint fatigue life by influencing the solder joint shape in BGA packages. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2024, 14(4): 611-618.

[6] Qimeng Sun, Junbo Yang, Shizhao Wang, Wei Shen*, Jianping Shi*, Yi Song*. Spectroscopic ellipsometry to characterize the Transition-Metal dichalcogenides single crystals doping concentration. Optics and Laser Technology, 2024, 174: 110633.

[7] Zhanpeng Sun#, Zijun Qi#, Kang Liang, Xiang Sun, Zhaofu Zhang, Lijie Li, Qijun Wang, Guoqing Zhang, Gai Wu*, Wei Shen*. A neuroevolution potential for predicting the thermal conductivity of α, β, and ε-Ga₂O₃. Applied Physics Letters, 2023, 123: 192202.

[8] Wei Shen^#, Gai Wu^#, Lijie Li, Hui Li, Sheng Liu*, Shengnan Shen*, Diwei Zou. Fluorine-terminated diamond (110) surfaces for nitrogen-vacancy quantum sensors. Carbon, 2022, 193:17-25.

[9] Wei Shen, Shengnan Shen*, Sheng Liu*, Hui Li, Yang Zhang, Qiaoxuan Zhang, Yuzheng Guo. Epoxy oxidized diamond (111)-(2×1) surface for nitrogen-vacancy based quantum sensors. Carbon, 2021, 173: 485-492.

[10] Wei Shen^#, Yuanhui Pan^#, Shengnan Shen*, Hui Li*, Siyuan Nie, Jie Mei. Intrinsic two-dimensional multiferroicity in CrNCl2 monolayer. Chinese Physics B, 2021, 471: 309-317.

[11] Wei Shen, Shengnan Shen*, Sheng Liu*, Hui Li, Zhiyin Gan, Qiaoxuan Zhang. Monolayer cubic boron nitride terminated diamond (111) surfaces for quantum sensing and electron emission applications. ACS Applied Materials & Interfaces, 2020, 12(29): 33336-33345.

[12] Wei Shen, Yuanhui Pan, Shengnan Shen*, Hui Li*, Yang Zhang, Guohao Zhang. Electron affinity of boron-terminated diamond (001) surface: A density functional theory study. Journal of Materials Chemistry C, 2019, 7(31): 9756-9765.

[13] Wei Shen, Shengnan Shen*, Sheng Liu*, Hui Li*, Siyuan Nie, Yuanhui Pan, Zhiqiang Tian, Qifan Li. Binding of hydrogen to phosphorus dopant in phosphorus-doped diamond surfaces: A density functional theory study. Applied Surface Science, 2019, 471: 309-317.

专利：

[1] Sheng Liu, Wei Shen, Gai Wu, Yuzheng Guo, Kang Liang, Qijun Wang, Shizao Wang. Strained Diamond Growth Doping Method Based on CVD Method. 授权号：US011519097B1, 美国专利, 2022.

[2] 刘胜，张贺辉，郭宇铮，王诗兆，孙亚萌，吴改，沈威，汪启军，马坤. 基于金刚石间接拉伸结构的金刚石/块铜衬底扩散键合工艺及结构，专利授权号：ZL202111542762.0，中国，发明专利.

[3] 刘胜，沈威，吴改，郭宇铮，梁康，汪启军，王诗兆. 一种基于CVD法的应变金刚石生长掺杂方法，专利授权号：ZL202210003968.4，中国，发明专利, 2022.

[4] 李辉，申胜男，张正浩，沈威. 面向NV色心的氧覆盖金刚石表面结构及其制备方法，专利授权号：202110581418.6，中国，发明专利, 2021.

[5] 李辉，刘胜，申胜男，邹迪玮，沈威. n型共掺杂金刚石半导体材料制备的多尺度耦合仿真方法，专利授权号：ZL202110646664.5，中国，发明专利, 2021.

[6] 申胜男，刘胜，李辉，沈威，彭庆，严晗. 一种n型磷掺杂金刚石薄膜中去除氢杂质的仿真方法，专利授权号：ZL201810180381.4，中国，发明专利, 2018.

[7] 刘胜，申胜男，李辉，沈威，彭庆，严晗. 一种n型磷掺杂金刚石薄膜制备过程中去除氢杂质的方法与装置，专利授权号：ZL201810180384.8，中国，发明专利, 2018.

 学生培养

欢迎研究生、本科生加入本课题组。

本科生培养，已指导7名本科生：①潘XX，2017级，2篇一作SCI，加州大学全奖直博；②聂XX，2018级，1篇一作SCI，上交保研；③陈XX，2018级，上交保研；④张XX，2020级，1篇一作SCI，香港科大全奖直博（港府奖学金）；⑤熊XX，2020级，1篇一作SCI，复旦直博；⑥邹XX，2020级，1篇一作SCI，香港科大全奖直博（港府奖学金）；⑦徐XX，2022级

科研项目

主持项目的信息：

[1] 国家自然科学基金-集成芯片重大研究计划-培育项目，2025-2027，主持

[2] 国家自然科学基金-青年科学基金，2023-2025，主持

[3] 华为技术有限公司-“晶圆XXXXXX研究”，2024-2025，主持

[4] 湖北省自然科学基金-青年科学基金，2023-2024，主持

[5] 武汉市知识创新专项项目-曙光计划，2024-2025，主持

[6] 湖北省超能电力有限责任公司，2024，主持

[7] 中央高校自主科研基金项目，2023-2024，主持

[8] 深圳市可持续发展科技专项双碳专项（子课题）

[9] 电子制造与封装集成湖北省重点实验室开放基金，主持

参与项目的信息：

[1] “XXX氧化镓半导体材料XXX”，湖北省XX科技计划，2023-2026，参与.

[2] MEMS传感器芯片先进封装测试平台，国家重点研发计划，2022-2025，参与.

[3] 薄膜生长缺陷跨时空尺度原位/实时监测与调控实验装置，国家自然科学基金委重大科研仪器研制项目，2018-2022，参与.

[4] n型掺杂金刚石半导体单晶材料制备及关键技术研究，广东省基础与应用基础研究重点项目，2020-2023，参与.

[5] 高性能n型磷掺杂金刚石薄膜的制备研究，深圳市协同创新计划国际合作研究项目，2019-2020，参与.

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