题目：5G高频器件先进封装技术

报告人：马盛林

时间：2019年12月10日上午9：30

地点：武汉大学雅各楼116会议室

欢迎各位师生踊跃参加！

摘要：

5G将启用更多高频段，这些高频器件如何封装集成？未来趋势如何？本讲做将在回顾5G高频器件封装集成技术现状基础上，介绍课题组在高频TSV/TGV互连、TSV IPD元件以及TSV 2.5D/3D射频集成应用方面的研究进展。

5G will adopt more high frequency bands. what kinds of package technology will used for these emerging High frequency devices？ What's the trend in future development？ This lecture will briefly review the state art of package technology adopted in 5G RF devices, expand the research progress of high-frequency TSV/TGV interconnection, TSV IPDs, and TSV 2.5D/3D RF integration application.

主讲人简介：

2012年7月毕业于北京大学，获微电子学与固态电子学专业博士学位、“北京大学优秀毕业生”、“北京市优秀毕业生”。2012年8月起在厦门大学机电工程系工作，2017年2018年陆续受聘为学副教授、博士生导师，2018年1月起至现在受聘为北京大学微米/纳米加工技术国家级重点实验室客座研究员。主要从事IC先进封装（TSV、3D SIP）、三维射频微系统集成、AlN超声波器件、植入电子微系统封装等方向研究工作，承担多项国家级重点课题任务，包括02国家科技重大专项、国家自然科学基金项目等；累计发表论文30余篇（SCI/EI检索），获得1项PCT专利、2项美国发明专利授权、10余项中国发明专利授权和2项台湾发明专利授权，指导研究生4人次获得学术会议最佳论文奖。

He received the Ph.D. degrees in microelectronics engineering from Peking University in 2012, with the honor of Outstanding Graduates from Peking University and Outstanding Graduates from Beijing. Since August 2012, he joined the Department of Mechanical and Electrical Engineering of Xiamen University, employed as an associate professor and doctoral tutor in 2017 and 2018 successively. He has also been employed as a guest researcher at the National Key Laboratory of Micro / Nano Machining Technology at Peking University since January 2018. His current research interests include IC advanced packaging (TSV, 3D SIP), 2.5D/3D RF integration, AlN based ultrasonic devices, and implanted electronic micro-system packaging, has won funding from many major projects, such as, National Natural Science Foundation of China, has published more than 30 journal and conference publications (SCI / EI), has 1 PCT patent, 2 US invention patent authorizations, more than 10 Chinese invention patent grants, 2 Taiwan invention patent grants, and 4 papers winning the best paper award at academic conferences.