题目：Millimeter-Wave and Terahertz Integrated Circuits and Systems for High-Speed Wireless Communication, Imaging, and Sensing

报告人：Taiyun Chi

时间：2018年6月29日上午9：00

地点：武汉大学动力与机械学院报告厅

欢迎各位师生踊跃参加！

Abstract text:

The past several decades have witnessed a dramatic evolution in wireless communication, imaging, and sensing applications enabled by integrated circuits technology. In this talk, I will first present the hardware design challenges and opportunities associated with these emerging applications. Then, I will explore how to push the fundamental limitations in fully integrated and self-contained electronic systems through circuit and system innovations.

Starting from high-power and high-efficiency signal generation, I will demonstrate a multi-feed antenna structure for low-loss direct on-antenna power combining. By exploring the unique advantage called electronics-antenna co-design, a conventional single-feed antenna is split into multiple electrically small radiators and driven by active circuits for collective and high-efficiency radiation.

The electronics-antenna co-design approach also enables antenna-domain self-interference cancellation for broadband full-duplex communication. I will discuss the design and implementation of an integrated full-duplex transceiver front-end, which achieves simultaneous transmission and reception of multi-Gb/s complex modulated signals at millimeter-wave frequency.

Finally, we will investigate the sub-millimeter-wave/Terahertz frequency range for non-invasive imaging and non-destructive quality control applications. Taking advantage of hyperspectral imaging, which operates over a wide continuous frequency range and offers spectroscopic information on each imaging pixel, I will demonstrate an ultra-wideband continuous-wave transceiver chipset that consists of a 90-300GHz transmitter and a 115-325GHz subharmonic coherent receiver. The operating bandwidth of this hyperspectral imaging system by far outperforms any reported THz electronic imagers.

Biography:

Taiyun Chi received the B.S. degree (with highest honor) from the University of Science and Technology of China (USTC), Hefei, China, in 2012, and the Ph.D. degree from the Georgia Institute of Technology, Atlanta, GA, in 2017. He is currently a Director at Speedlink Technology Inc., Cupertino, CA, leading the development of broadband millimeter-wave transceiver front-end for 5G communication.

Dr. Chi has authored and co-authored more than 40 IEEE publications, including 6 ISSCC papers. His research interests include RF/millimeter-wave/Terahertz integrated circuits and systems, integrated bio-sensors and biology-electronics hybrid systems.

Dr. Chi was a recipient of the Sigma Xi Best Ph.D. Thesis Award (Georgia Tech Chapter) in 2018, the Solid-State Circuits Society (SSCS) Predoctoral Achievement Award in 2018, the IEEE Custom Integrated Circuits Conference (CICC) Best Paper Award in 2017, the Microwave Theory and Techniques Society (MTT-S) Graduate Fellowship for Medical Applications in 2016, the Analog Devices Inc. Outstanding Student Designer Award in 2015, the Texas Instruments CICC Student Scholarship Award in 2014, the Georgia Tech GEDC Fellowship in 2012, and the USTC Guo Moruo Presidential Scholarship in 2012. He was also a co-recipient of the IEEE SENSORS Best Live Demo Award (2nd place) in 2016, and the IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Best Student Paper Award in 2018 (2nd place) and 2016 (2nd place).