个人简介

吴国强，博士，博士生导师，武汉大学工业科学研究院教授，获批国家自然科学基金优秀青年科学基金项目、湖北省自然科学基金杰出青年项目，入选湖北省高级人才项目。兼任中国仪器仪表学会微纳器件与系统技术分会理事，IEEE高级会员、中国微米纳米技术学会高级会员、中国仪器仪表学会高级会员，担任IEEE CASS-EDS-SSCS武汉联合分会秘书，受邀担任领域旗舰会议IEEE MEMS（2023、2024）技术程序委员会委员。2013年毕业于中国科学院上海微系统与信息技术研究所，获得工学博士学位。博士论文入选上海市优秀研究生成果（学术论文）。2014至2018年就职于新加坡科技局微电子研究院，担任研究员、项目负责人。2018年9月以青年学术带头人身份入职武汉大学。主要研究方向为MEMS传感器与智能微系统，特别在MEMS谐振器与振荡器、MEMS陀螺仪、MEMS声学传感器等方向有深厚的研究基础。近五年，主持国家自然科学基金、国家重点研发计划课题、全军装备预研专用技术课题、国内重要企业资助等十余项科研项目。现已在IEEE JMEMS、IEEE EDL、IEEE TED、IEEE TIE、APL等本领域主流期刊发表学术论文60余篇，指导研究生获IEEE MEMS 2021最佳学生论文入围奖，合作出版专著1部，已获授权国家发明专利31项（含美国发明专利2项）。

论文发表和专利

1) Yuhao Xiao, Jinzhao Han, Kewen Zhu, and Guoqiang Wu*, “A micro-oven controlled dual-mode piezoelectric mems resonator with ±190 ppb stability over -40 to 105 ºC temperature range,” IEEE Electron Device Letters, vol. 44, no. 8, pp. 1340-1343, Aug. 2023.

2) Yunxin Yao, Licheng Jia, Chongbin Liu, Xiangyang Wang, Chengliang Sun, Sheng Liu, and Guoqiang Wu*, “A transceiver integrated piezoelectric micromachined ultrasound transducer array for underwater imaging,” Sensors and Actuators A: Physical, vol. 359, p. 114476, Sep. 2023.

3) Wen Chen, Wenhan Jia, Yuhao Xiao, and Guoqiang Wu*, “Anchor loss reduction for square-extensional mode MEMS resonator using tethers with auxiliary structures,” IEEE Sensors Journal, vol. 23, no. 14, pp. 15454-15460, Jul. 2023.

4) Jinzhao Han, Yuhao Xiao, Wen Chen, Kewen Zhu, and Guoqiang Wu*, “Mechanically coupled single-crystal silicon MEMS resonators for TCF manipulation,” Journal of Microelectromechanical Systems, vol. 32, no. 3, pp. 271-278, Jun. 2023.

5) Yuhao Xiao, Jinzhao Han, Kewen Zhu, and Guoqiang Wu*, “A piezoelectric mechanically coupled Lamé mode resonator with ultra-high Q,” Applied Physics Letters, vol. 122, no. 11, p. 114101, Mar. 2023.

6) Zhongye Wu, Ronghui Feng, Chengliang Sun, Peng Wang, and Guoqiang Wu*, “A dual-mass fully decoupled MEMS gyroscope with optimized structural design for minimizing mechanical quadrature coupling,” Microelectronic Engineering, vol. 269, p. 111918, Jan. 2023.

7) Chongbin Liu, Licheng Jia, Lei Shi, Chengliang Sun, Daw Don Cheam, Peng Wang, and Guoqiang Wu*, “Theoretical modeling of piezoelectric micromachined ultrasonic transducers with honeycomb structure,” Journal of Microelectromechanical Systems, vol. 31, no. 6, pp. 984-993, Dec. 2022.

8) Jinzhao Han, Yuhao Xiao, Wen Chen, Wenhan Jia, Kewen Zhu, and Guoqiang Wu*, “Temperature compensated bulk-mode capacitive MEMS resonators with ±16 ppm temperature stability over industrial temperature range,” Journal of Microelectromechanical Systems, vol. 31, no. 5, pp. 723-725, Oct. 2022.

9) Lei Shi, Licheng Jia, Chongbin Liu, Chengliang Sun, Sheng Liu, and Guoqiang Wu*, “A miniaturized ultrasonic sugar concentration detection system based on piezoelectric micromachined ultrasonic transducers,” IEEE Transactions on Instrumentation and Measurement, vol. 71, Article No. 7503509, Jul. 2022.

10) Zhikai Zhou, Chongbin Liu, Licheng Jia, Lei Shi, Xianzhong Wang, Jifang Tao, Chengliang Sun, and Guoqiang Wu*, “A ScAlN piezoelectric high-frequency acoustic pressure-gradient MEMS vector hydrophone with large bandwidth,” IEEE Electron Device Letters, vol. 43, no. 7, pp. 1109-1112, Jul. 2022.

11) Licheng Jia, Lei Shi, Chongbin Liu, Jing Xu, Yongjie Gao, Chengliang Sun, Sheng Liu, and Guoqiang Wu*, “Piezoelectric micromachined ultrasonic transducer array-based electronic stethoscope for internet of medical things,” IEEE Internet of Things Journal, vol. 9, no. 12, pp. 9766-9774, Jun. 2022.

12) Wen Chen, Wenhan Jia, Yuhao Xiao, and Guoqiang Wu*, “Design, modeling and characterization of high-performance bulk-mode piezoelectric MEMS resonators,” Journal of Microelectromechanical Systems, vol. 31, no. 3, pp. 318-327, Jun. 2022.

13) Wenhan Jia, Wen Chen, Yuhao Xiao, Zhongye Wu, and Guoqiang Wu*, “A micro-oven controlled dual-mode piezoelectric MEMS resonator with ±400 ppb stability over -40 to 80 ºC temperature range,” IEEE Transactions on Electron Devices, vol. 69, no. 5, pp. 2597-2603, May, 2022.

14) Shangshu Yang, Zhongye Wu, Wenhan Jia, and Guoqiang Wu*, “Ultra-low relative frequency split piezoelectric ring resonator designed for high-performance mode-matching gyroscope,” Journal of Microelectromechanical Systems, vol. 31, no. 1, pp. 6-8, Feb. 2022.

15) Licheng Jia, Lei Shi, Zhaoyang Lu, Chengliang Sun, and Guoqiang Wu*, “A high-performance 9.5% scandium-doped aluminum nitride piezoelectric MEMS hydrophone with honeycomb structure,” IEEE Electron Device Letters, vol. 42, no. 12, pp. 1845-1848, Dec. 2021.

16) Wen Chen, Wenhan Jia, Yuhao Xiao, Zhihong Feng, and Guoqiang Wu*, “A temperature-stable and low impedance piezoelectric MEMS resonator for drop-in replacement of quartz crystals,” IEEE Electron Device Letters, vol. 42, no. 9, pp. 1382-1385, Sept. 2021.

17) Licheng Jia, Lei Shi, Chongbin Liu, Yunxin Yao, Chengliang Sun, and Guoqiang Wu*, “Design and characterization of an aluminum nitride-based MEMS hydrophone with biologically honeycomb architecture,” IEEE Transactions on Electron Devices, vol. 68, no. 9, pp. 4656-4663, Sept. 2021.

18) Licheng Jia, Lei Shi, Chongbin Liu, Chengliang Sun, and Guoqiang Wu*, “Enhancement of transmitting sensitivity of piezoelectric micromachined ultrasonic transducers by electrode design,” IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control., vol. 68, no. 11, pp. 3371-3377, Nov. 2021.

19) Zhongye Wu, Shangshu Yang, Longjian Xue, Chengliang Sun, Sheng Liu, and Guoqiang Wu*, “Ultra-low stress die attachment based on a stacked multilayer substrate,” Journal of Microelectromechanical Systems, vol. 30, no. 4, pp. 497-499, Aug. 2021.

20) Guoqiang Wu^#,*, Jinghui Xu#, Eldwin Jiaqiang Ng, and Wen Chen, “MEMS resonators for frequency reference and timing applications,” Journal of Microelectromechanical Systems, vol. 29, no. 5, pp. 1137-1166, Oct. 2020.

21) Jinghui Xu^#, Kevin Tshun-Chuan Chai^#, Guoqiang Wu^#, Eva Leong-Ching Wai, Wei Li, Jason Yeo, Edwin Nijhof, and Yuandong Gu*, “Low cost, tiny sized MEMS hydrophone sensor for water pipeline leak detection,” IEEE Transactions on Industrial Electronics, vol. 66, no. 8, pp. 6374-6382, Aug. 2019.

22) Guoqiang Wu^#,*, Beibei Han^#, Daw Don Cheam^#, Eva Wai Leong Ching, Peter Hyun Kee Chang, Navab Singh, and Yuandong Gu, “Development of six-degree-of-freedom (DOF) inertial sensors with an 8-inch advanced MEMS fabrication platform,” IEEE Transactions on Industrial Electronics., vol. 66, no. 5, pp. 3835-3842, May 2019.

23) Guoqiang Wu^#,*, Jinghui Xu^#, Xiaolin Zhang, Nan Wang, Danlei Yan, Jayce Lay Keng Lim, Yao Zhu, Wei Li, and Yuandong Gu, “Wafer-level vacuum-packaged high performance AlN-on-SOI piezoelectric resonator for Sub-100 MHz oscillator applications,” IEEE Transactions on Industrial Electronics, vol. 65, no. 4, pp. 3576-3584, Apr. 2018.

24) Guoqiang Wu*, Geng Li Chua, Navab Singh, and Yuandong Gu, “A quadruple mass vibrating MEMS gyroscope with symmetric design,” IEEE Sensors Letters, vol. 2, no. 4, p. 2501404, 2018.

25) Guoqiang Wu*, Geng Li Chua, and Yuandong Gu, “A dual-mass fully decoupled MEMS gyroscope with wide bandwidth and high linearity,” Sensors and Actuators A: Physical, vol 259, pp. 50-56, Mar. 2017.

26) Guoqiang Wu, Yao Zhu, Srinivas Merugu, Nan Wang, Chengliang Sun*, and Yuandong Gu, “GHz spurious mode free AlN lamb wave resonator with high figure of merit using one dimensional phononic crystal tethers,” Applied Physics Letters, vol. 109, no. 1, pp. 013506, Jul. 2016.

27) Guoqiang Wu*, Dehui Xu, Bin Xiong, Lufeng Che, and Yuelin Wang, “Design, fabrication and characterization of a resonant magnetic field sensor based on mechanically coupled dual-microresonator,” Sensors and Actuators A: Physical, vol. 248, pp. 1-5, Jul. 2016.

28) Guoqiang Wu, Dehui Xu*, Xiao Sun, Bin Xiong, and Yuelin Wang, “Wafer-level vacuum packaging for microsystems using glass frit bonding,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, no. 10, pp. 1640-1646, Oct. 2013.

29) Guoqiang Wu, Dehui Xu*, Bin Xiong, Duan Feng and Yuelin Wang, “Resonant magnetic field sensor with capacitive driving and electromagnetic induction sensing,” IEEE Electron Device Letters, vol. 34, no. 3, pp. 459-461, Mar. 2013.

30) Guoqiang Wu*, Dehui Xu, Bin Xiong, Yuchen Wang, Yuelin Wang, and Yinglei Ma, “Wafer-level vacuum packaging for MEMS resonators using glass frit bonding,” Journal of Microelectromechanical Systems, vol. 21, no. 6, pp. 1484-1491, Dec. 2012.

31) Guoqiang Wu, Dehui Xu*, Bin Xiong, and Yuelin Wang, “Wheatstone bridge piezoresistive sensing for bulk-mode micromechanical resonator,” Applied Physics Letters, vol. 101, no. 19, p. 193505, Nov. 2012.

32) Guoqiang Wu*, Dehui Xu, Bin Xiong, and Yuelin Wang, “Redistribution of electrical interconnections for three-dimensional wafer-level packaging with silicon bumps,” IEEE Electron Device Letters, vol. 33, no. 8, pp. 1177-1179, Aug. 2012.

所获荣誉

1. 上海市研究生优秀成果（学位论文）（2015）

2. 中国科学院院长优秀奖（2013）

3. 开设课程