题目：Development of 3-D RF Microsystems Using Additive Manufacturing Technologies

报告人：Fan Cai

时间：2018年6月29日上午10：00

地点：武汉大学动力与机械学院报告厅

欢迎各位师生踊跃参加！

Abstract text:

 Following the broad applications in the areas of biology, mechanics, consumer products, etc., 3-D printing technologies have been progressively expanded into RF applications over the last decade. However, 3-D printing is still in its early stage for RF circuits and systems due to the fine feature size requirement and limited material options. The state-of-the-art 3-D technologies can address this challenge by enabling cost-effective, environmental friendly, and complex RF components to achieve superior performance with a fast production cycle compared with conventional fabrication methods.

In the talk, I will present low-loss 3-D transmission lines, vertical interconnects, and RF components fabricated by Aerosol Jet Printing (AJP) and Polyjet Printing technologies, which are state-of-the-art 3-D printing technologies. This work paves the way for 3-D printed cost-effective multilayer System-on-Package and RF/millimeter-wave front-end modules.

Biography:

Fan Cai received the B.S. degree from the Huazhong University of Science and Technology, Wuhan, China, in 2008, and the Ph.D. degree from the Georgia Institute of Technology, Atlanta, GA, in 2015. During 2015 summer, she was with Skyworks Solutions where she was involved in the development of RF front-end module for LTE-Advanced carrier aggregation. In 2016, She was with Formfactor where she was involved in the signal integrity analysis for high-end DRAM and Flash probe cards. Since 2017, she has been with Broadcom, working on high-speed Serializer/Deserializer (SerDes), signal integrity, and IC-packaging co-optimization.

Dr. Cai has authored more than 10 top-tier journals, conferences, and patents in the area of microwave engineering. Her current research interests include RF/millimeter-wave circuits and systems, SerDes, packaging, and 3D printing.